Interrelationship between rheological characteristics of dough and quality of biscuits; use of elastic recovery of dough to predict biscuit quality

Sai Manohar, R. and Haridas Rao, P. (2002) Interrelationship between rheological characteristics of dough and quality of biscuits; use of elastic recovery of dough to predict biscuit quality. Food Research International, 35. pp. 807-813.

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Abstract

<p align="justify">Rheological characteristics of biscuit doughs as influenced by ingredients, processing conditions and additives were related to the quality of biscuits. Extrusion time r=minus0.54, P less than 0.01, elastic recovery r=minus0.84, P less than 0.01, apparent biaxial extensional viscosity r=minus0.62, P less than 0.01, consistency r=minus0.73, P less than 0.01 and hardness r=0.68, P less than 0.01 of the dough were significantly correlated to the spread of the biscuits. Elastic recovery r=0.64, P less than 0.01 and cohesiveness r=0.67, P less than 0.01 of dough mainly influenced the thickness of biscuits. Extrusion time (r=0.53, P less than 0.01), elastic recovery (r=0.78, P less than 0.01), apparent biaxial extensional viscosity (r=0.59, P less than 0.01), consistency (r=0.62, P less than 0.01) and hardness (r=0.60, P less than 0.01) were positively correlated to density of biscuits. The density of biscuits was found to be well correlated to sensory texture (r=minus0.49, P less than 0.01). The studies have clearly shown that among the various rheological characteristics, elastic recovery was found to be the best index in predicting the textural quality of biscuits.</p>

Item Type:	Article
Uncontrolled Keywords:	Rheological characteristics Biscuit dough Texture Elastic recovery
Subjects:	600 Technology > 08 Food technology > 14 Physical properties 600 Technology > 08 Food technology > 26 Bakery products
Divisions:	Flour Milling Bakery and Confectionary Technology
Depositing User:	Food Sci. & Technol. Information Services
Date Deposited:	15 Dec 2005
Last Modified:	28 Dec 2011 09:25
URI:	http://ir.cftri.res.in/id/eprint/271

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