Influence Of Hydroxypropyl Methylcellulose On The Rheological And Microstructural Characteristics Of Whole Wheat Flour Dough And Quality Of Puri
Sudha, M. L. and Venkateswara Rao, G. (2009) Influence Of Hydroxypropyl Methylcellulose On The Rheological And Microstructural Characteristics Of Whole Wheat Flour Dough And Quality Of Puri. Journal of Texture Studies, 40. pp. 172-191.
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Abstract
Puri is a traditional unleavened fried product prepared from whole wheat flour. Hydroxypropyl methylcellulose (HPMC) was used to study its effect on rheological characteristics of whole wheat flour dough and puri making quality. Addition of HPMC at 0.5 and 1.0% w/w increased the water absorption and dough stability whereas the resistance to extension and extensibility decreased. Pasting temperature, peak viscosity and cold paste viscosity gradually decreased. The moisture and fat contents of puri increased marginally. Quality parameters and sensory acceptability were monitored after 0 and 8 h of storage. Addition of 0.5% HPMC gave higher sensory scores. Microscopic observations during puri processing showed that the starch granules in the control dough were clearly visible in the protein matrix, which reduced on frying due to partial gelatinization. Microstructure of puri with HPMC showed higher gelatinization of starch. It also helped in moisture retention and hence, resulted in highly pliable and soft-textured puri.
Item Type: | Article |
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Uncontrolled Keywords: | Puri, Microstructure, hydroxypropyl methylcellulose, Hydroxypropyl methylcellulose, pasting characteristics, puri, rheological characteristics, scanning electron microscopy, whole wheat flour dough |
Subjects: | 600 Technology > 08 Food technology > 14 Physical properties 600 Technology > 08 Food technology > 26 Bakery products |
Divisions: | Flour Milling Bakery and Confectionary Technology |
Depositing User: | Food Sci. & Technol. Information Services |
Date Deposited: | 12 Nov 2010 11:34 |
Last Modified: | 28 Dec 2011 10:19 |
URI: | http://ir.cftri.res.in/id/eprint/9778 |
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