Thermal conductivity of Indian unleavened flat bread (Chapati) at various stages of baking.

A steady state technique was used to measure thermal conductivity of whole wheat dough (for production of rolled chapatti) and baked chapatti (round disc prepared mostly from whole wheat flour dough) at various stages of cooking. Based on the experimental data of chapatti at various stages of cooking, a linear equation K = -0.5677 + 0.01396 M + 0.005131 T is proposed for conductivity of wheat flour dough and baked chapatti at moisture levels (M): 35 < M < 50% [wet basis] and temp. ranges 35 < T < 60